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Izixhumi ze-SIM khadi nezixhumi ze-SIM khadi encane nezixhumi ze-Nano SIM khadi

Isixhumi Sekhadi LeSIM Encane,8P

Isixhumi Sekhadi LeSIM Encane,8P

Isixhumi Sekhadi LeSIM Encane, 6P

Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P+1P Noma 8P+1P,H1.50mm KLS1-SIM-090

Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P Noma 6P+1P,H1.35mm KLS1-SIM-069

Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P Noma 6P+1P,H1.35mm,Ngaphandle kokuthunyelwe. Impahla: Isivikelo:Izinga Lokushisa EliphezuluThermoplastic,UL94V-0 Xhumana:Ingxubevange yethusi,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Contact RevoltageAC AC/DC5. I-Insulation Resistance:1000M Min./500VDC Ambient Humidity Range:95% RH Ma...

Isixhumi Sekhadi LeSIM Encane 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P

Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane 8P,PUSH PULL,H2.4mm Izinto: Isisekelo:Hi-Temp Thermoplastic,UL94V-0.Black. Oxhumana Naye Ngemininingwane: Ingxubevange yethusi, Icwecwe Legolide. Igobolondo:Insimbi Engagqwali, Icwecwe Legolide. Ugesi: Ukumelana Nokuxhumana:50mΩ okuvamile,100Ω Max. I-Insulation Resistance:>1000MΩ/500V DC. 3.Isigaba Somhwamuko Solderability:215ºC.30sec.Max. Ukugeleza kwe-IR:250ºC.5sec.Max. Ukudayiswa mathupha:370ºC.3sec.Max. Izinga Lokushisa Lokusebenza: -45ºC~+105&o...

Isixhumi se-Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P

Ulwazi Lomkhiqizo Isixhumi se-Micro SIM Card 6P,PUSH PULL,H2.4mm Izinto: Isisekelo:Hi-Temp Thermoplastic,UL94V-0.Black. Oxhumana Naye Ngemininingwane: Ingxubevange yethusi, Icwecwe Legolide. Igobolondo:Insimbi Engagqwali, Icwecwe Legolide. Ugesi: Ukumelana Nokuxhumana:50mΩ okuvamile,100Ω Max. I-Insulation Resistance:>1000MΩ/500V DC. 3.Isigaba Somhwamuko Solderability:215ºC.30sec.Max. Ukugeleza kwe-IR:250ºC.5sec.Max. Ukudayiswa mathupha:370ºC.3sec.Max. Izinga Lokushisa Lokusebenza: -45ºC~+105&o...

Isixhumi se-SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ngokuthunyelwe noma Ngaphandle kweposi. I-KLS1-SIM-110

Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM;PUSH PUSH,6P+2P,H1.80mm Ngokuthunyelwe noma Ngaphandle kweposi.Impahla:Impahla Yendlu: LCP UL94V-0Into yokuxhumana: I-Tin-BronzeIphakheji: Iphakheji ye-Tape ne-ReelIzici Zogesi:Isilinganiso se-Voltage: I-Voltage Rating: 100V Wirent Rating: 100V Wirent Rating: 250V AC/1MinuteUkumelana nokufakwa: ≥1000ΜΩUkumelana nokuxhumana: ≤30mΩImpilo:

Isixhumi se-SIM Card,PUSH PUSH,8P+1P,H1.9mm,enePost KLS1-SIM-108

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,8P+1P,H1.9mm,ene-Post Material: Izindlu:Hi-Temp Plastic,UL94V-0.Ilinganiselwe. Xhumana: I-Copper Alloy. Igobolondo: I-Copper Alloy. Ukucwenga: Indawo yokuxhumana:I-Gold flash. Indawo ye-Solder:80u" Min, Matte tin alloy plated. Ngaphansi kwepuleti:30u" min,Nickel. Igobolondo:30u" Min,Nickel plated generalIndawo yokudambisa:I-Gole flash. Kagesi: Isilinganiso samanje:0.5A. I-Voltage emile:AC500V rms Insulation Resistance:1000MΩMin,Ku-DC 500V ...

Isixhumi se-SIM Card,PUSH PUSH,6P+1P,H1.9mm,enePost KLS1-SIM-107

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P+1P,H1.9mm,ene-Post Material: Izindlu:Hi-Temp Plastic,UL94V-0.Ilinganiselwe. Xhumana: I-Copper Alloy. Igobolondo: I-Copper Alloy/Insimbi. Ukucwenga: Indawo yokuxhumana:I-Gold flash. Indawo ye-Solder:80u" Min, Matte tin alloy plated. Ngaphansi kwepuleti:30u" min,Nickel. Igobolondo:30u" Min,I-Nickel plated yonke indawo ye-Solder:I-Gole flash. Ogesi: Isilinganiso samanje:0.5A. I-Voltage emelana nogesi:AC500V rms Insulation Resistance:1000MΩMin,At...

Isixhumi Sekhadi le-SIM;PUSH PUSH,6P,H1.85mm KLS1-SIM-106

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ene-Post Housing:Hi-Temp Plastic,UL94V-0.Ikaliwe. Xhumana: I-Copper Alloy. Igobolondo:SUS. Qeda: Igolide lifakwe endaweni yokuhlangana, Uthayela obekwe emisileni ye-solder. Ingxenye Inombolo. Incazelo PCS/CTN GW(KG) CMB(m3) OrderQty. Isikhathi Oda

Isixhumi Sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-087

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" min I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Plating ku-Contact Arer,80u" min Tin on Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms. I-Insulation Resist...

Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm, ngaphandle kwe-Post KLS1-SIM-086

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" min I-Nickel Ifakwe Ngaphansi ku-Allover,GoldPlating ku-Contact Arer,80u" min Tin on Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms. Insulation Resis...

Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+2P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-085A

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,8P+2P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Thintana:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" iminithi ye-Nickel Ifakwe Ngaphansi kwe-Allover,I-Gold Plating ku-Contact Arer,80u" minTin ku-Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-GoldFlash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms. Insulation Resist...

Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+2P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-085

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,8P+2P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" min I-Nickel Ifakwe Ngaphansi kwe-Allover,I-Gold Plating ku-Contact Arer,80u" min Tin on Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-GoldFlash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms. Insulation Resi...

Isixhumi se-SIM Card,PUSH PUSH,6P+2P,H1.85mm, ngaphandle kokuthunyelwe KLS1-SIM-084

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ngaphandle kwe-Post Material: Izindlu:LCP,UL94V-0 Xhumana:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.OperatingFlashCleat:+5ºFlash Finish:+5ºG OperatingFlashFild~ Indawo;I-Gold Flash Ifakwe Emisileni Ye-Solder,Ngokuthintana Naye Konke Kufakwe Ngaphansi Kwama-50u" amaminithi e-Nickel. Igobolondo:50u" iminithi I-Nickel Ifakwe Ngaphansi Ngaphansi Sekukonke,I-Gold Flash Ifakwe Emisileni Edayisiwe. Inombolo Yengxenye Incazelo I-PC...

Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-074B

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post Material: Izindlu:Izinga Lokushisa Eliphezulu Thermoplastic,UL94V-0.Black. Xhumana: I-Copper Alloy. Ikhava:Thinta: Ama-Copper Alloys Noma Insimbi. Ukucwenga: I-Underplate:Nickel. Indawo yokuxhumana:Igolide phezu kweNickel. Indawo ye-Solder: Tin Over Nickel. Igobolondo:I-G/F Plate Ngaphezu Kwe-Nickel Emisileni Ethengiswayo Ekagesi: Isilinganiso samanje:0.5A. Isilinganiso samandla kagesi: 5.0 Vrms. I-Insulation Resistance:500M Min.At DC 500V DC Withstanding Voltage:250V A...

Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-074A

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Thintana:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" iminithi ye-Nickel Ifakwe Ngaphansi kwe-Allover,I-Gold Plating ku-Contact Arer,80u" minTin ku-Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-GoldFlash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms. I-Insulation Resistanc...

Isixhumi seSIM khadi,PUSH PUSH,6P,H1.85mm,ngokuThumela nangaphandle Iposi KLS1-SIM-073A

Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngokuthunyelwe nangaphandle Okuthunyelwe Ugesi: Isilinganiso samanje:0.5A. Isilinganiso samandla kagesi: 5.0 Vrms. I-Insulation Resistance:500M Min.At DC 500V DC Withstanding Voltage:250V ACrms Iminithi elingu-1. Ukumelana Nokuxhumana:100M Max.At 10MA/20mVMAX. Izinga Lokushisa Lokusebenza: -45ºC~+85ºCMatingCycles:5000 Ukufakwa. Impahla: Isivikelo:H-Temperature Plastic,UL94V-0.Mnyama. Oxhumana naye:Ingxube yethusi,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15...

Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-064A

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Thintana:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" iminithi ye-Nickel Ifakwe Ngaphansi kwe-Allover,I-Gold Plating ku-Contact Arer,80u" minTin ku-Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flashon Solder Latch. Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms. Insulation Resist...

Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+2P,H1.80mm,ngaphandle kwe-Post KLS1-SIM-030C

Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+2P,H1.80mm,ngaphandle Kwempahla Yeposi: Izindlu:LCP,UL94V-0 Xhumana:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. Qeda: Xhumana:I-Gold Flash Plated Endaweni Yokuthintana Naye;I-Gold Flash Ifakwe Emisileni Ye-Solder, Ngokuthintana OkupheleleNgaphansi Kwama-50u" amaminithi e-Nickel. Igobolondo:50u" iminithi ye-Nickel I-Underplated Sekukonke,I-GoldFlash Ifakwe Emisileni Ye-Solder.Izinga lokushisa elisebenzayo: -45ºC~+85ºC Ingxenye No.

Isixhumi se-SIM Card,PUSH PUSH,6P+2P,H1.85mm,enePost KLS1-SIM-030D

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ene-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm;Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" min I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Plating ku-Contact Arer,80u" min Tin on Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5Avoltage Isilinganiso: 5.0 Vrms. Ukumelana Ne-Insulation...

Isixhumi se-SIM Card,PUSH PUSH,6P+2P,H1.85mm,enePost KLS1-SIM-030F

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ene-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm;Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u" min I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Plating ku-Contact Arer,80u" min Tin on Solder Tail. Igobolondo:50u" I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch. Ogesi: Isilinganiso samanje:0.5Avoltage Isilinganiso: 5.0 Vrms. Ukumelana Ne-Insulation...

Isixhumi Sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-030E

Ulwazi Lomkhiqizo Isixhumi sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngaphandle kwezinto zokuthumela: Izindlu:Hi-Temp Plastic,UL94V-0.Ilinganiselwe. Xhumana: I-Copper Alloy. Igobolondo:Insimbi Engagqwali.SUS 301,T=0.20mm. I-Plating: Indawo yokuxhumana:G/F Ihlanganiswe ngaphezu kuka-30u" Indawo ye-Nickel Solder:80u" Tin Plated phezu kuka-30u" Nickel. Ngaphansi kwepuleti:30u" Min Nickel. Shell:30u" Min,Nickel Plated Over All,SolderArea:Gold Flash. Electrical: Current Rating:0.5 A Dielectric Withstanding Voltage:250...
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