Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-074B

Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-074B
  • encane-img

Sicela ulande imininingwane ye-PDF:


pdf

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Isixhumi se-SIM Card,PUSH PUSH,8P+1P,H1.85mm, ngaphandle kokuthunyelwe Isixhumi se-SIM Card,PUSH PUSH,8P+1P,H1.85mm, ngaphandle kokuthunyelwe

Ulwazi Lomkhiqizo
Isixhumi se-SIM Card,PUSH PUSH,8P+1P,H1.85mm, ngaphandle kokuthunyelwe

Okubalulekile:
Ezezindlu:Izinga Lokushisa Eliphezulu
I-Thermoplastic, UL94V-0.Mnyama.
Xhumana: I-Copper Alloy.
Ikhava: Xhumana: Ama-Copper Alloys Noma Insimbi.

Ukucwenga:
I-Underplate:Nickel.
Indawo yokuxhumana:Igolide phezu kweNickel.
Indawo ye-Solder: Tin Over Nickel.
Igobolondo:I-G/F Plate Ngaphezu Kwe-Nickel Emisileni Ethengiswayo

Okogesi:
Isilinganiso samanje: 0.5A.
Isilinganiso samandla kagesi: 5.0 Vrms.
I-Insulation Resistance: 500M Min.At DC 500V DC
I-Voltage Withstanding:250V ACrms Iminithi elingu-1.
Ukumelana Nokuxhumana:100M Max.Ku-10MA/20mVMAX.
Izinga Lokushisa Lokusebenza: -45ºC~+85ºC
Imijikelezo yokukhwelana: 5000 Ukufakwa.


Ingxenye No. Incazelo I-PCS/CTN I-GW(KG) I-CMB(m3) I-odaQty. Isikhathi Oda


  • Okwedlule:
  • Olandelayo: