Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+1P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-074B
Sicela ulande imininingwane ye-PDF:
Imininingwane Yomkhiqizo
Omaka bomkhiqizo
|
Isixhumi se-SIM Card,PUSH PUSH,8P+1P,H1.85mm, ngaphandle kokuthunyelwe Okubalulekile: Ezezindlu:Izinga Lokushisa Eliphezulu I-Thermoplastic, UL94V-0.Mnyama. Xhumana: I-Copper Alloy. Ikhava: Xhumana: Ama-Copper Alloys Noma Insimbi. Ukucwenga: I-Underplate:Nickel. Indawo yokuxhumana:Igolide phezu kweNickel. Indawo ye-Solder: Tin Over Nickel. Igobolondo:I-G/F Plate Ngaphezu Kwe-Nickel Emisileni Ethengiswayo Okogesi: Isilinganiso samanje: 0.5A. Isilinganiso samandla kagesi: 5.0 Vrms. I-Insulation Resistance: 500M Min.At DC 500V DC I-Voltage Withstanding:250V ACrms Iminithi elingu-1. Ukumelana Nokuxhumana:100M Max.Ku-10MA/20mVMAX. Izinga Lokushisa Lokusebenza: -45ºC~+85ºC Imijikelezo yokukhwelana: 5000 Ukufakwa. |
Ingxenye No. | Incazelo | I-PCS/CTN | I-GW(KG) | I-CMB(m3) | I-odaQty. | Isikhathi | Oda |