Isixhumi se-Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P
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| Isixhumi se-Micro SIM Card 6P,PUSH PULL,H2.4mm Okubalulekile: Isisekelo:Hi-Temp Thermoplastic,UL94V-0.Black. Oxhumana Naye Ngemininingwane: Ingxubevange yethusi, Icwecwe Legolide. Igobolondo:Insimbi Engagqwali, Icwecwe Legolide. Okogesi: Ukumelana Nokuxhumana:50mΩ okujwayelekile,100Ω Max. I-Insulation Resistance:>1000MΩ/500V DC. 3.I-Solderability Isigaba somhwamuko:215ºC.30sec.Max. Ukugeleza kwe-IR:250ºC.5sec.Max. I-soldering eyenziwa mathupha:370ºC.3sec.Max. Izinga Lokushisa Lokusebenza: -45ºC~+105ºC |
| Ingxenye No. | Incazelo | I-PCS/CTN | I-GW(KG) | I-CMB(m3) | I-odaQty. | Isikhathi | Oda |
