I-CONN PLUG I-MICRO USB UHLOBO B I-Solder T3.0,L8.8mm KLS1-235-2
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| Okubalulekile Izindlu: I-Hing Temperature Thermoplastics, I-UL94V-0 LCP,Mnyama. Xhumana: I-Copper Alloy C2680. Igobolondo: Ingxubevange yethusi C2680/SPCC. Qeda: Xhumana: Igolide Elicwecwe Endaweni Yokukhwelana; I-Tin On Solder Talls. Igobolondo:Nickel Plating. Okogesi: Isilinganiso samanje: 1.5A/Contact Terminal. Isilinganiso samandla kagesi: 30V DC Ukumelana Nokuxhumana:30mΩ Max. I-Dielectric Withstanding Voltage: 500 V AC AT Sea Level. I-Insulation Resistance: 1000MΩ Min. I-Connector Mate kanye ne-Unmated Force I-Mate Force:3.75kgf Max. Amandla Angalingani:1.02kgf Min. Ukugcinwa Kwetheminali:1.2kgf Min. |
| Ingxenye No. | Incazelo | I-PCS/CTN | I-GW(KG) | I-CMB(m3) | I-odaQty. | Isikhathi | Oda |
