I-830 Point Solderless Breadboard ku-backplate ye-aluminium KLS1-BB830C

I-830 Point Solderless Breadboard ku-backplate ye-aluminium KLS1-BB830C
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I-830 Point Solderless Breadboard ku-backplate ye-aluminium I-830 Point Solderless Breadboard ku-backplate ye-aluminium I-830 Point Solderless Breadboard ku-backplate ye-aluminium

Ulwazi Lomkhiqizo
830 amaphuzuI-breadboard ifakwe ku-backplate ye-aluminium.
  • Izimbobo zokugcina: 830
  • Material: ABS plastic
  • Okuthunyelwe okubophayo: 3
  • Ubukhulu: 183 x105mm
  • Iza ngokumhlophe ngalokho kubukeka okuhlanzekile (hhayi obala)
  • 3 Izikhala Ezibophezelayo
  • 1 Terminal Strip, 630 Tie-points
  • Imichilo engu-2 yokusabalalisa, amaphuzu angama-200 wokubopha
  • Usayizi we-breadboard 16.5×5.4×0.85 (cm)
  • Izixhumanisi ezinemibala ukuze kube lula ukubeka ingxenye
  • Yamukela osayizi abahlukahlukene bezintambo (AWG:20-29)
  • Ilungele amaphrojekthi we-DIY, i-prototyping nokuhlola
  • Ulwazi Lwe-oda:
    I-KLS1-BB830C-01
    830: 830 iphuzu
    Imibala etholakalayo:Okumhlophe futhi Okusobala




Ingxenye No. Incazelo I-PCS/CTN I-GW(KG) I-CMB(m3) I-odaQty. Isikhathi Oda

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