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Isixhumi Sekhadi LeSIM Encane,6Pin H1.42mm KLS1-SIM-105
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane,6Pin H1.42mm Impahla: Isivikelo:I-High Temperature Thermoplastic,UL 94V-0 Xhumana:Ingxubevange yethusi,Plated 50u” Ni Ooverall Xhumana Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Plated 1uIsici Esikhethekile Sokuthinta Ugesi isilinganiso:0.5mA AC/DC ubuningi bamandla kagesi:125V AC/DC Ibanga Lezinga Lokushisa Lendawo:-20°C~+60°C Ibanga Lokushisa Lesitoreji:-40°C~+70°C Ububanzi Bokuswakama Kwendawo:95% RH ubuningi bokuxhumana...
I-Micro SIM Card CONN,6P,H1.45mm,SMD KLS1-SIM-046
Izithombe Zomkhiqizo Impahla Yolwazi Lomkhiqizo: Izindlu:LCP,UL94V-0 Xhumana:C5210 , I-Flash Flash Ecwebeziwe Endaweni Yokuxhumana; I-Gold Flash Plating Emisileni Ethengiswayo; Nge-Entrre Contact Igobolondo Le-Nickel Elifakwe Ngaphansi:SUS304,Nickel Yenziwe Ngaphansi Ngaphansi Kwakho Konke, Igolide Ifuleshi Libekwe Emisileni Ethengiswayo Kagesi Imininingwane: Isilinganiso samanje:0.5A Voltage Rating:5V Contact Resistance:50mΩ Max. Ukumelana nokushisisa:1000MΩ Min Durabiliy:3000 Cycles Min
Isixhumi Sekhadi Le-SIM Elincane,8Pin H1.5mm,Uhlobo Olunamaphiko KLS1-SIM-089
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane,8Pin H1.5mm,Uhlobo Olunezihibe Izindlu Ezibalulekile:Thermoplastic,UL94V-0. Itheminali:I-Phosphor Bronze,T=0.15,I-Ni Plated Ngaphansi,Au Ifakwe Endaweni Yokuxhumana,G/F Ifakwe Ku-Soldertail. Igobolondo:Insimbi Engagqwali,T=0.15,Ni Plated Under,G/F Plated On Soldertail. Ukumelana Nokuxhumana Nogesi:60mΩ Max. I-Insulation Resistance: 1000MΩ Min. I-Dielectric Withstanding Voltage: 500V AC Iminithi elingu-1. Ukuqina:5000 Cycles. Izinga Lokushisa Lokusebenza: -45ºC~+85ºC
Isixhumi sekhadi le-SIM eliNcane, i-6Pin H1.8mm, uhlobo olunama-Hinged KLS1-SIM-072
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane,6Pin H1.8mm,Izisetshenziswa zohlobo olune-Hinged: Izindlu:LCP,UL94V-0,Mnyama. Itheminali:I-Copper Alloy. Igobolondo:Insimbi Engagqwali. Ugesi: Isilinganiso samanje:1A Max. Isilinganiso samandla kagesi: 30V DC max. Ukumelana Nokuxhumana:30mΩ Max. I-Insulation Resistance: 1000MΩ Min. I-Dielectric Voltage: 500V rms/min. Ukuqina:5000 Cycles. Izinga Lokushisa Lokusebenza: -45ºC~+85ºC
Isixhumi Sekhadi LeSIM Encane,6Pin H1.5mm,uhlobo lwethreyi KLS1-SIM-075
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane,6Pin H1.5mm,Impahla yohlobo lwethreyi: Isivikelo:Hi–Temperature Plastic,UL94V-0,Mnyama. Itheminali:I-Copper Alloy.I-Gold Flash Plating kuyo yonke itheminali, i-Aad 50u” min I-Nickel Ifakwe ngaphansi kwe-allover. Okagesi: Isilinganiso Samanje:0.5A Isilinganiso Samandla Kagesi:5.0 vrms Ukumelana Nokufakwa Kwamandla:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms For 1Minute Contact Res...
Isixhumi Sekhadi LeSIM Encane,6P,PUSH PULL,H1.5mm KLS1-SIM-099
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane,6P,PUSH PULL,H1.5mm Material Housing:Thermoplastic,UL94V-0. Itheminali:I-Copper Alloy,Igolide Efakwe Endaweni Yokuthintana Nemisila Ye-Solder,I-Nickel Ehlanganiswe Sekukonke. Igobolondo:Insimbi Engagqwali.I-Nickel Ifakwe Ingqikithi.IgolideIfakwe Emisileni Edayisiwe. Ugesi: Isilinganiso samanje:1.0 A max. Ukumelana Nokuxhumana:30mΩ Max. I-Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min./500V DC Izinga Lokushisa Lokusebenza: -45ºC~+85ºC
Isixhumi Sekhadi LeSIM Encane,8P,PUSH PULL,H1.5mm KLS1-SIM-091
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane,8P,PUSH PULL,H1.5mm Ekagesi: Ikalwe Okwamanje:1.0A Isilinganiso sikagesi esilinganiselwe:30V Ukumelana Nokuxhumana:50mΩ Max. I-Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Ukuqina:5000 Cycles Min. Ukumelana Nokuxhumana: 50mΩ Max. Izinga Lokushisa Lokusebenza: -45ºC~+85ºC
Isixhumi Sekhadi LeSIM Encane, 6P
Izithombe Zomkhiqizo
Isixhumi Sekhadi LeSIM Encane, 6P
Izithombe Zomkhiqizo
Isixhumi Sekhadi LeSIM Encane,8P
Izithombe Zomkhiqizo
Isixhumi Sekhadi LeSIM Encane,8P
Izithombe Zomkhiqizo
Isixhumi Sekhadi LeSIM Encane,8P
Izithombe Zomkhiqizo
Isixhumi Sekhadi LeSIM Encane, 6P
Izithombe Zomkhiqizo
Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P+1P Noma 8P+1P,H1.50mm KLS1-SIM-090
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P+1P Noma 8P+1P,H1.50mm Isilinganiso Samanje Samandla Kagesi: 0.5A Isilinganiso sikagesi:5.0 vrms Ukumelana nokuxhumana:100mΩ Max. Ukumelana ne-insulation: 1000M Min. Amandla kagesi amelana: 250V ACrms Iminithi elingu-1. Operating TempRange:-45℃-+105℃ Material: Insulator:Hi-Temperature plastic,UL94V-0,Black Terminal:Copper Alloy,Gold Flash Plating On All Terminal, Kanye ne-50u” min nickel efakwe ngaphansi kwe-allover. Igobolondo:Insimbi Engagqwali,50u&...
Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P Noma 6P+1P,H1.35mm KLS1-SIM-069
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane;PUSH PUSH,6P Noma 6P+1P,H1.35mm,Ngaphandle kokuthunyelwe. Material: Insulator:High Temperature Thermoplastic,UL94V-0 Contact:Copper Alloy,Plated 50U” Ni Overall Contact Au 1U Shell:SUS,Plated 50U” Ni Overall Plated 1u” Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Contact Ukulinganisa kwe-AC/DC 0 Revoltage AC/DC 0 Ukumelana:1000M Min./500VDC Ambient Humidity Range:95% RH Max Mati.
Isixhumi Sekhadi LeSIM Encane 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi LeSIM Encane 8P,PUSH PULL,H2.4mm Izinto: Isisekelo:Hi-Temp Thermoplastic,UL94V-0.Black. Oxhumana Naye Ngedatha: Ingxubevange yethusi, Icwecwe Legolide. Igobolondo:Insimbi Engagqwali, Icwecwe Legolide. Ugesi: Ukumelana Nokuxhumana:50mΩ okuvamile,100Ω Max. I-Insulation Resistance:>1000MΩ/500V DC. 3.Isigaba Somhwamuko Solderability:215ºC.30sec.Max. Ukugeleza kwe-IR:250ºC.5sec.Max. Ukudayiswa mathupha:370ºC.3sec.Max. Izinga Lokushisa Lokusebenza: -45ºC~+105ºC
Isixhumi se-Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Esincane Sekhadi LeSIM 6P,PUSH PULL,H2.4mm Izinto: Isisekelo:Hi-Temp Thermoplastic,UL94V-0.Black. Oxhumana Naye Ngedatha: Ingxubevange yethusi, Icwecwe Legolide. Igobolondo:Insimbi Engagqwali, Icwecwe Legolide. Ugesi: Ukumelana Nokuxhumana:50mΩ okuvamile,100Ω Max. I-Insulation Resistance:>1000MΩ/500V DC. 3.Isigaba Somhwamuko Solderability:215ºC.30sec.Max. Ukugeleza kwe-IR:250ºC.5sec.Max. Ukudayiswa mathupha:370ºC.3sec.Max. Izinga Lokushisa Lokusebenza: -45ºC~+105ºC
Isixhumi se-SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ngokuthunyelwe noma Ngaphandle kweposi. I-KLS1-SIM-110
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM;PUSH PUSH,6P+2P,H1.80mm Ngokuthunyelwe noma Ngaphandle kweposi. Material: Impahla Yezindlu: LCP UL94V-0 Impahla Yokuxhumana: Iphakheji Le-Tin-Bronze: Iphakeji ye-Tape ne-Reel Iphakheji Izimpawu zikagesi: Isilinganiso samandla kagesi: 100V AC Isilinganiso samanje: 0.5A Max Mela i-voltage: 250V AC/1Minute Ukumelana nokufakwa kwe-Insulation: ≩0 Ukumelana ne-Insulation: ≩0 Ukumelana ne-Insulation 0ΥΤ0 Ukumelana ne-0ΥΤ0 ≩0 Impilo: ＞5000Cycles Operating Temperature: -45ºC~+85ºC
Isixhumi se-SIM Card,PUSH PUSH,8P+1P,H1.9mm,enePost KLS1-SIM-108
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+1P,H1.9mm,ene-Post Material: Izindlu:Hi-Temp Plastic,UL94V-0.Ilinganiselwe. Xhumana: I-Copper Alloy. Igobolondo: I-Copper Alloy. Ukucwenga: Indawo yokuxhumana:I-Gold flash. Indawo edayiswayo:80u” Min, i-Matte tin alloy plated. Ngaphansi kwepuleti:30u” min,Nickel. I-Shell:30u” Min,I-Nickel plated isiyonke indawo yeSolder:I-Gole flash.Ogesi: Isilinganiso samanje:0.5A. I-Voltage emile:AC500V rms Insulation Resistance:1000MΩMin,Ku-DC 500V Thintana ne-R...
Isixhumi se-SIM Card,PUSH PUSH,6P+1P,H1.9mm,enePost KLS1-SIM-107
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+1P,H1.9mm,ene-Post Material: Izindlu:Hi-Temp Plastic,UL94V-0.Ilinganiselwe. Xhumana: I-Copper Alloy. Igobolondo: I-Copper Alloy/Insimbi. Ukucwenga: Indawo yokuxhumana:I-Gold flash. Indawo edayiswayo:80u” Min, i-Matte tin alloy plated. Ngaphansi kwepuleti:30u” min,Nickel. I-Shell:30u” Min,I-Nickel plated yonke indawo ye-Solder:I-Gole flash.Ogesi: Isilinganiso samanje:0.5A. I-Voltage emile:AC500V rms Insulation Resistance:1000MΩMin,Ku-DC 500V Qhubek...
Isixhumi Sekhadi le-SIM;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ene-Post Housing:Hi-Temp Plastic,UL94V-0.Ilinganiselwe. Xhumana: I-Copper Alloy. Igobolondo:SUS. Qeda: Igolide lifakwe endaweni yokuhlangana, Uthayela obekwe emisileni ye-solder.
Isixhumi Sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-087
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,6P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u” min I-Nickel Ifakwe Ngaphansi ku-Allover,I-Gold Plating ku-Contact Arer,80u” min Tin on Solder Tail. Igobolondo:50u” I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch.Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms.I-Insulation Resistance:500...
Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm, ngaphandle kwe-Post KLS1-SIM-086
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi le-SIM,PUSH PUSH,6P+2P,H1.85mm,ngaphandle kwe-Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Othintwayo:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u” min I-Nickel Ifakwe Ngaphansi ku-Allover,I-Gold Plating ku-Contact Arer,80u” min Tin on Solder Tail. IShell:50u” I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch.Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms.I-Insulation Resistance:...
Isixhumi Sekhadi le-SIM,PUSH PUSH,8P+2P,H1.85mm,ngaphandle kwe-Post KLS1-SIM-085A
Izithombe Zomkhiqizo Ulwazi Lomkhiqizo Isixhumi Sekhadi Le-SIM,PUSH PUSH,8P+2P,H1.85mm,ngaphandle Kwempahla Yeposi: Isivikelo:H-Temperature Plastic,UL94V-0.Mnyama. Othintwayo:I-Copper Alloy,T=0.15mm Igobolondo:Insimbi Engagqwali,T=0.15mm Finsh: Itheminali:50u” min I-Nickel Ifakwe Ngaphansi ku-Allover,I-Gold Plating ku-Contact Arer,80u” min Tin on Solder Tail. Igobolondo:50u” I-Nickel Ifakwe Ngaphansi Ku-Allover,I-Gold Flash ku-Solder Latch.Ogesi: Isilinganiso samanje:0.5A. Isilinganiso sikagesi:5.0 Vrms.I-Insulation Resistance...- English
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